Title:
POLISHING TOOL
Document Type and Number:
Japanese Patent JP2015039735
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a superior polishing tool not causing scratches and achieving high processing efficiency, and to provide a method for manufacturing such the polishing tool.SOLUTION: There is provided a polishing tool in which: a binder layer 2 for fixing multiple abrasive grains 3 is disposed on a base material 1 surface; and at least a portion of the abrasive grains 3 are arranged in a protruding state from the binder layer 2. In the polishing tool, the spherical abrasive grains 3 has a Dof 30 μm or more and a Dof 100 μm or less in a grain diameter distribution of the abrasive grains 3, and a difference between a maximum value and a minimum value in protrusion amount of the multiple abrasive grains 3, from a surface line of the binder layer 2, is 10 μm or less.
Inventors:
KODA TAKUYA
CHO SUSUMU
SAWADA KIYOTAKA
KAI SATOSHI
DAI YANGYANG
CHO SUSUMU
SAWADA KIYOTAKA
KAI SATOSHI
DAI YANGYANG
Application Number:
JP2013171677A
Publication Date:
March 02, 2015
Filing Date:
August 21, 2013
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
B24D3/00; B24D3/28
Attorney, Agent or Firm:
Hideo Takino
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