Title:
POLYARYLENE RESIN COMPOSITIONS
Document Type and Number:
Japanese Patent JP2018095856
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide polyarylene oligomer compositions capable of curing at lower temperatures than conventional polyarylene oligomers, and compositions useful in forming dielectric material layers in electronics applications.SOLUTION: A composition comprises: one or more polyarylene polymers having a backbone comprising as repeating units one or more aryl moieties having one or more epoxy-reactive moieties, the one or more polyarylene polymers comprising as polymerized units one or more polyalkynyl-substituted aryl first monomers and one or more biscyclopentadienone second monomers represented by the formula in the figure; and one or more epoxide-containing crosslinkers. A method comprises: coating a surface of a substrate with a layer of the composition; and curing the layer of the composition to form a cross-linked polyarylene layer.SELECTED DRAWING: None
Inventors:
CHRISTOPHER GILMORE
AARON A RACHFORD
ZHANG JIEQIAN
DING PING
LEE DONG-EUN
ANTON LI
KIM YOUNG-SEOK
AARON A RACHFORD
ZHANG JIEQIAN
DING PING
LEE DONG-EUN
ANTON LI
KIM YOUNG-SEOK
Application Number:
JP2017233162A
Publication Date:
June 21, 2018
Filing Date:
December 05, 2017
Export Citation:
Assignee:
ROHM & HAAS ELECT MAT
International Classes:
C08L65/00; C08G59/40; C08G61/02; C08K5/1515; C08L63/00
Domestic Patent References:
| JP2016196633A | 2016-11-24 | |||
| JP2004292554A | 2004-10-21 | |||
| JP2016053155A | 2016-04-14 | |||
| JP2016121131A | 2016-07-07 | |||
| JP2015110775A | 2015-06-18 |
Foreign References:
| US7816482B1 | 2010-10-19 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office