Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYACETAL RESIN COMPOSITION HAVING EXCELLENT MOLD RELEASABILITY
Document Type and Number:
Japanese Patent JP2005263929
Kind Code:
A
Abstract:

To improve mold releasability during molding processing to an ultrahigh level without substantially deteriorating mechanical characteristics of a polyacetal resin at all.

A polyacetal resin composition is obtained by adding (B) 0.1-0.2 pt.wt. of at least one kind of compound selected from a fatty acid ester compound and a fatty acid amide compound having 400-800 molecular weight and having 50-80°C melting point and (C) 0.2-0.3 pt.wt. of at least one kind of compound selected from a fatty acid ester compound and a fatty acid amide compound having 400-800 molecular weight in the same manner and having 100-160°C melting point to (A) 100 pts.wt. of the polyacetal resin.


Inventors:
TANIMURA NORITAKA
HASHIMOTO YOSHIYUKI
Application Number:
JP2004076930A
Publication Date:
September 29, 2005
Filing Date:
March 17, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L59/00; C08K5/103; C08K5/20; (IPC1-7): C08L59/00; C08K5/103; C08K5/20
Domestic Patent References:
JP2002003696A2002-01-09
JP2005263928A2005-09-29
JP2005263927A2005-09-29
JP2000239485A2000-09-05
JP2000026704A2000-01-25
JPH11323076A1999-11-26
JPH11181231A1999-07-06
JPH09221579A1997-08-26
JPH07324155A1995-12-12
JPH073117A1995-01-06
JPH06212051A1994-08-02
JPH11343383A1999-12-14
JPS56163144A1981-12-15
JPS63260949A1988-10-27
Foreign References:
WO2002024807A12002-03-28
WO1997009381A11997-03-13