Title:
ポリアミド系フィルム積層体
Document Type and Number:
Japanese Patent JP5151046
Kind Code:
B2
Inventors:
Buri Tanaka
Ken Kogen
Osamu Tokinoya
Ken Kogen
Osamu Tokinoya
Application Number:
JP2006067401A
Publication Date:
February 27, 2013
Filing Date:
March 13, 2006
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
B32B9/04; B32B27/00; B32B27/34
Domestic Patent References:
| JP2005178804A | ||||
| JP2002103446A |
Foreign References:
| WO2004048081A1 |