Title:
POLYAMIDE-BASED RESIN COMPOSITION FOR INJECTION FOAMING, AND INJECTION FOAM MOLDING
Document Type and Number:
Japanese Patent JP2016029141
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide-based resin composition for injection foaming capable of obtaining an injection foam molding having a high expansion ratio, uniform cells and excellent impact resistance with high formability.SOLUTION: A polyamide-based resin composition for injection foaming includes a polyamide resin (A) with a relative viscosity measured on conditions of 96% sulfuric acid as a solvent at a temperature of 25°C at a concentration of 1 g/100 ml being in a range of 2.0-4.0, and a polytetrafluoroethylene-containing resin (B). A content of the polytetrafluoroethylene-containing resin (B) with respect to 100 pts.wt. of the polyamide resin (A) is 0.05-3 pts.mass. A strain hardening coefficient measured at a temperature obtained by adding 10°C to the melting point of the resin composition is 1.05-10.SELECTED DRAWING: Figure 1
Inventors:
NEGI YUKINARI
ISHII SHIGEAKI
ISHII SHIGEAKI
Application Number:
JP2015043623A
Publication Date:
March 03, 2016
Filing Date:
March 05, 2015
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08L77/00; C08J9/06; C08K3/34; C08K3/36; C08K7/14; C08L23/08; C08L23/26; C08L27/18; C08L51/00
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