Title:
ポリアミド及び添加剤を含むポリアミド組成物
Document Type and Number:
Japanese Patent JP6907224
Kind Code:
B2
Abstract:
The present invention relates to a polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process.
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Inventors:
Gabriel claus
Grammrich, Jimon
Osterman, liner
Richter, Florian
Rafael, Dabo
Meier, thomas
Schloff, Wolfgang
Grammrich, Jimon
Osterman, liner
Richter, Florian
Rafael, Dabo
Meier, thomas
Schloff, Wolfgang
Application Number:
JP2018544088A
Publication Date:
July 21, 2021
Filing Date:
February 16, 2017
Export Citation:
Assignee:
BASF SE
International Classes:
C08L77/00; B29C64/153; B29C64/268; B33Y10/00; B33Y70/00; B33Y80/00; C08K5/3437; C08K5/3465
Domestic Patent References:
| JP49127709A | ||||
| JP6202330A | ||||
| JP2012251148A | ||||
| JP11509485A | ||||
| JP2017014388A |
Foreign References:
| US20120329932 | ||||
| CN103597033A |
Other References:
Bio-Medical Materials and Engineering, 2007, Vol.17, p.147-157
Attorney, Agent or Firm:
Satoshi Eto