Title:
POLYAMIDE COMPOSITION
Document Type and Number:
Japanese Patent JPH0551531
Kind Code:
A
Abstract:
PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M<3>(HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.
Inventors:
MORITA KIMIHIRO
KITAMURA KAZUYUKI
KITAMURA KAZUYUKI
Application Number:
JP23253091A
Publication Date:
March 02, 1993
Filing Date:
August 21, 1991
Export Citation:
Assignee:
ASAHI CHEMICAL IND
International Classes:
C08K3/30; C08L77/00; C08L77/06; (IPC1-7): C08K3/30; C08L77/06
Attorney, Agent or Firm:
Takeshi Shimizu (1 person outside)
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