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Title:
POLYAMIDE COMPOSITION
Document Type and Number:
Japanese Patent JPS62215657
Kind Code:
A
Abstract:

PURPOSE: The titled composition, obtained by blending a specific polyamide elastomeric copolymer with a specific amount of an inorganic reinforcing filler, having high rigidity and improved impact resistance without deteriorating chemical resistance and suitable as an industrial injection molding material.

CONSTITUTION: A composition obtained by blending 100pts.wt. total of (A) 60W99pts.wt. one or more polyamide resins, e.g. nylon 12, etc., selected from a polyamide resin prepared by polymerizing a 4W12C ω-aminocarboxylic acid or lactam and a polyamide resin obtained by polymerizing an aliphatic dicarboxylic acid having ≥20 total number of carbon atoms and aliphatic diamine and (B) 1W40pts.wt. polyamide elastomeric copolymer consisting of (B1) 30W95pts.wt. polyamide, e.g. nylon 12, as a hard segment and (B2) 5W70pts. wt. polyoxymethylene, e.g. polyoxytetramethylene glycol, etc., as a soft segment with (C) 5W150pts.wt. inorganic reinforcing filler, e.g. glass fibers, etc.


Inventors:
KAMEI HIROAKI
Application Number:
JP5803086A
Publication Date:
September 22, 1987
Filing Date:
March 18, 1986
Export Citation:
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Assignee:
DAICEL HUELS KK
International Classes:
C08K3/00; C08L77/00; (IPC1-7): C08K3/00; C08L77/00
Domestic Patent References:
JPS59193957A1984-11-02