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Title:
POLYAMIDE FILM-FORMING COMPOSITION AND TRANSPARENT POLYAMIDE FILM
Document Type and Number:
Japanese Patent JP2009144084
Kind Code:
A
Abstract:

To provide a polyamide film-forming composition to give a polyamide film excellent in mechanical properties and antistatic property, and to provide a transparent polyamide film produced through the crosslinking and insolubilization of the composition.

The polyamide film-forming composition includes (i) a N-methyl alkoxy methyl polyamide resin whose one part of hydrogen atom bound with the nitrogen atom is substituted by alkoxy methyl group, (ii) an organic silicone compound having an acidic group, (iii) an alkoxy silane and/or a (partial)hydrogenation condensation product thereof, and (iv) an organic solvent. The composition includes a polyamide as a matrix high in strength, moreover contains a reaction product of an alkoxy silane having an acidic group and an alkoxy silane and/or a (partial)hydrogenation condensation product thereof and can give a film excellent in the balance between conductivity like antistatic property, transparency, and hardness.


Inventors:
FUKUSHIMA MOTOO
YAMATANI MASAAKI
Application Number:
JP2007324235A
Publication Date:
July 02, 2009
Filing Date:
December 17, 2007
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L77/00; C08G77/28; C08K5/5415; C08K5/548; C08L83/08; C09K3/16
Domestic Patent References:
JP2004014232A2004-01-15
JP2005005046A2005-01-06
JP2004346316A2004-12-09
JP2007176968A2007-07-12
JP2002184427A2002-06-28
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa