Title:
POLYAMIDE-IMIDE FILM AND IMAGE DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2021038402
Kind Code:
A
Abstract:
To provide a polyamide-imide precursor for forming a film having excellent mechanical properties and heat resistance.SOLUTION: There is provided a polyamide-imide film having an imidized polyamide-imide precursor. The polyamide-imide precursor comprising: in a molecular structure thereof, a first block obtained by copolymerizing monomers including dianhydride and diamine; and a second block obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine, wherein the dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB). The molar ratio of the first block and the second block is 5:1 to 1:1. The polyimide film has an elongation at break of 7% or more, which is measured based on ASTM D882 (a film thickness of 10 to 50 μm). The polyimide film has a dimension change difference (▵DC) of 100 μm or less, which is defined by a difference (|A-B|) between a minimum value on a first heat-increasing curve (a dimension change value measured at 50°C, A) and a minimum value on a cooling curve (a dimension change value measured at 50°C, B) when repeatedly measured one to three times in a section at 50 to 250°C using a thermomechanical analysis method (TMA-method) based on a film thickness of 10 to 50 μm.SELECTED DRAWING: None
Inventors:
KIM JAE IL
JUNG HAK GEE
JUNG HAK GEE
Application Number:
JP2020188152A
Publication Date:
March 11, 2021
Filing Date:
November 11, 2020
Export Citation:
Assignee:
KOLON INC
International Classes:
C08J5/18; C08G73/14; G09F9/00
Domestic Patent References:
| JP2012241196A | 2012-12-10 | |||
| JP2014528490A | 2014-10-27 |
Foreign References:
| WO2013100557A1 | 2013-07-04 |
Attorney, Agent or Firm:
Yamashita