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Patent Searching and Data


Title:
POLYAMIDE-IMIDE RESIN COMPOSITION AND ITS PREPARATION
Document Type and Number:
Japanese Patent JPS58104925
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled resin composition having improved resistance to heat softening, by reacting a polycarboxylic acid containing citric acid with a diisocyanate and a lactam.

CONSTITUTION: A resin composition obtained by reacting a polycarboxylic acid containing 10mol% or more citric acid and/or a derivative thereof, preferably an aromatic tricarboxylic acid, particularly trimellitic acid, with a diisocyanate and/or a derivative thereof, preferably an aromatic diisocyanate and/or the aromatic diisocyanate masked with a phenol, particularly 4,4'-diphenylmethane diisocyanate, and a lactam, e.g. -caprolactam, in a phenolic solvent, and adding 5W150pts.wt., expressed in terms of polyisocyanate based on 100pts.wt. resultant resin content in the reaction product, polyisocyanate compound masked with a phenol to the reaction product.


Inventors:
WAKE MISAO
Application Number:
JP20462681A
Publication Date:
June 22, 1983
Filing Date:
December 18, 1981
Export Citation:
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Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
C08L79/08; C08G18/00; C08G18/34; C08G73/14; (IPC1-7): C08G73/14; C08L79/08
Attorney, Agent or Firm:
Suyama Saichi