To provide a polyamide resin composition having low water absorption rate, and excellent in dimensional stability from room temperature to high temperature environment, and very much suited to cases of information communication devices.
A polyamide resin composition is obtained by blending 0.01-200 pts.wt. of an inorganic filler to 100 pts.wt. of a polyamide resin obtained by polycondensing monomers including tetramethylene diamine and ≥7C aliphatic dicarboxylic acid as principal components; and having a ratio (storage elastic modulus at 110°C/storage elastic modulus at 30°C) of a storage elastic modulus at 110°C measured in bending mode to a storage elastic modulus at 30°C measured in bending mode is 0.30 or more and a tanδ peak top value corresponding to a glass transition temperature of the polyamide resin is 0.98 or less.
MASUNAGA ATSUSHI
KATO KIMIYA
UMETSU HIDEYUKI
