POLYAMIDE RESIN COMPOSITION AND CASING BODY FOR ELECTRONIC EQUIPMENT

Title:

POLYAMIDE RESIN COMPOSITION AND CASING BODY FOR ELECTRONIC EQUIPMENT

Document Type and Number:

Japanese Patent JPH06240132

Kind Code:

A

Abstract:

PURPOSE: To obtain a polyamide resin composition to be molded useful as a housing material for thin-wall portable equipments and excellent in water and chemical resistance, fluidity in molding, mechanical properties and rigidity with hardly any warpage and deformation and a casing body for electronic equipments such as a personal computer and a word processor having ≤2mm average plate thickness by molding this polyamide resin composition.

CONSTITUTION: This polyamide resin composition is obtained by blending 100 pts.wt. resin composition composed of 20-80wt.% aromatic polyamide resin and 80-20wt.% modified polyphenylene ether resin (the sum total of wt.% thereof is 100wt.%) with 0.5-30 pts.wt. liquid crystal polymer, 0.01-3 pts.wt. compatibilizer, 2-40 pts.wt. inorganic filler and optionally a rubber component. A resin molding is excellent even when the wall thickness is ≤2mm, more preferably ≤1mm.

Inventors:

NISHII KOTA
KIMURA KOICHI
ISHIZUKA MASANOBU
ADACHI KATSURA

Application Number:

JP2932893A

Publication Date:

August 30, 1994

Filing Date:

February 18, 1993

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJITSU LTD

International Classes:

C08K3/34; C08K5/35; C08K7/02; C08L51/08; C08L71/12; C08L77/00; C08L77/10; H01B3/30; C08L67/00; C08L77/12; (IPC1-7): C08L71/12; C08L71/12; C08K3/34; C08K5/35; C08K7/02; C08L51/08; C08L77/00

Attorney, Agent or Firm:

Shoichi Ui (3 others)

Previous Patent: A method for the closing system for a container, a related container, and realization

Next Patent: ELECTRODE OF ELECTRON GUN