Title:
POLYAMIDE RESIN COMPOSITION, FILM AND FILM LAMINATE CONTAINING THE SAME, AND PELLET MIXTURE
Document Type and Number:
Japanese Patent JP2022149536
Kind Code:
A
Abstract:
To provide a polyamide resin composition which gives a film that prevents aggregation of appearance caused by a film gel and is excellent in pinhole resistance under a low temperature environment, and a film and a film laminate including the same.SOLUTION: A polyamide resin composition contains 86.4-99.2 mass% of a polyamide resin (A), 0.1-10.0 mass% of an ethylene/α-olefin copolymer (B), and 0.1-10.0 mass% of a metal salt (C) of an ethylene/methacrylic acid copolymer, in 100 mass% of the polyamide resin composition.SELECTED DRAWING: None
Inventors:
NAKAMOTO SHOGO
YAMASHITA ATSUSHI
YABU NAOYASU
YAMASHITA ATSUSHI
YABU NAOYASU
Application Number:
JP2021051743A
Publication Date:
October 07, 2022
Filing Date:
March 25, 2021
Export Citation:
Assignee:
UBE CORP
International Classes:
C08L77/00; B32B27/34; C08J5/18; C08K5/13; C08K5/36; C08K5/49; C08L23/08
Attorney, Agent or Firm:
Patent Attorney Corporation Tsukuni