To provide a polyamide resin composition for an IC tray which, while having low water absorbency, achieves a sufficiently high molecular weight, has a wide moldable temperature range calculated from the difference between the melting point and the thermal decomposition temperature thereof, has excellent melt moldability and excellent electrical conductivity, and is more excellent in heat resistance, chemical resistance, hydrolysis resistance and the like as compared with conventional aliphatic polyamide resins.
The polyamide resin composition for an IC tray contains an electrical conductivity-imparting agent in a polyamide resin wherein the dicarboxylic acid component is composed of oxalic acid and the diamine component is composed of a mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine (hereinafter called a C9 diamine mixture) and 1,6-hexanediamine (hereinafter called C6 diamine). The molar ratio between the C9 diamine mixture and C6 diamine is from 1:99 to 99:1.
NAKAGAWA TOMOYUKI
KURACHI KOICHIRO
OKUSHITA YOJI
| JP2000191771A | 2000-07-11 | |||
| JP2004285147A | 2004-10-14 |
| WO2008072754A1 | 2008-06-19 |
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