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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION AND ITS MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2001081314
Kind Code:
A
Abstract:

To obtain a reinforced polyamide resin composition excellent in discoloration resistance and mechanical properties even in environments of a high- temperature atmosphere and ultraviolet exposure.

This polyamide resin composition is obtained by further including an inorganic pigment in an amount of 1-30 pts.wt. based on 100 pts.wt. of a polyamide resin and a phosphorus compound in an amount of 0.0005-0.2 pt.wt. based on 100 pts.wt. of the polyamide resin and expressed in terms of phosphorus element in the polyamide resin composition prepared by including an inorganic filler in an amount of 10-200 pts.wt. based on 100 pts.wt. of the polyamide resin therein.


Inventors:
TOMIYAMA HIROSHI
Application Number:
JP26244899A
Publication Date:
March 27, 2001
Filing Date:
September 16, 1999
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
C08J5/00; C08K3/22; C08K3/32; C08K5/524; C08L77/00; (IPC1-7): C08L77/00; C08K3/22; C08K5/524