Title:
POLYAMIDE RESIN COMPOSITION FOR LASER MARKING, MOLDING, AND LASER MARKING METHOD
Document Type and Number:
Japanese Patent JP2021130278
Kind Code:
A
Abstract:
To provide a polyamide resin composition for laser marking which is excellent in laser marking property and surface glossiness when being formed into a molding, and a molding using the polyamide resin composition for laser marking and a laser marking method.SOLUTION: A polyamide resin composition for laser marking contains (A) a polyamide resin, (B) carbon black, and (C) nigrosine. A molding is obtained by molding the polyamide resin composition for laser marking. A laser marking method performs printing on the molding obtained by molding the polyamide resin composition for laser marking by irradiation with a laser beam.SELECTED DRAWING: None
Inventors:
SAKUMA TERUAKI
NAKAJIMA MASA
OYAMADA HIROSHI
NAKAJIMA MASA
OYAMADA HIROSHI
Application Number:
JP2020027482A
Publication Date:
September 09, 2021
Filing Date:
February 20, 2020
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
B41M5/26; C08K3/013; C08K3/04; C08K3/40; C08L77/00
Attorney, Agent or Firm:
Sumio Tanai
Yasushi Matsunuma
Masato Iida
Field Saki Satoshi
Ryu Miyamoto
Yasushi Matsunuma
Masato Iida
Field Saki Satoshi
Ryu Miyamoto