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Title:
POLYAMIDE RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2002129012
Kind Code:
A
Abstract:

To obtain a composition excellent in strength and elastic modulus by dispersing a layered silicate, at a molecular level, into a polyamide having meta-xylylene diadipamido as the main unit.

The polyamide resin composition containing the layered silicate of 0.01-40 mass% in the polyamide obtained from a dicarboxylic acid component having an adipic acid as a main ingredient and a diamine component having meta-xylylene diamine as the ingredient is characterized in that the distance of layer space in the silicate is 20 or more. The method for producing the composition is characterized in that the diamine component is added to the mixture of the dicarboxylic acid component and the layered silicate in the melting state to polycondensate them.


Inventors:
INAGAKI KOJI
MATSUOKA FUMIO
TAKAHASHI MASAMI
Application Number:
JP2000327126A
Publication Date:
May 09, 2002
Filing Date:
October 26, 2000
Export Citation:
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Assignee:
UNITIKA LTD
International Classes:
C08G69/28; C08K3/34; C08L77/06; (IPC1-7): C08L77/06; C08G69/28; C08K3/34
Domestic Patent References:
JP2001329168A2001-11-27
JP2000290500A2000-10-17
JP2001329169A2001-11-27