Title:
ポリアミド樹脂組成物、成形品、キットおよび成形品の製造方法
Document Type and Number:
Japanese Patent JP7300571
Kind Code:
B2
Abstract:
To provide a polyamide resin composition excellent in light transmittance, a molding, a kit and a method for manufacturing a molding.SOLUTION: A polyamide resin composition is composed of a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, in which more than 60 mol% of the diamine-derived structural unit is derived from meta-xylylene diamine and 70 mol% or more of the dicarboxylic acid-derived structural unit contains 40-80 mass% of a polyamide resin derived from α,ω-straight chain aliphatic dicarboxylic acid having 4 to 20 carbon atoms and further contains a light-permeable dye and a glass fiber containing at least one of a sizing agent and a surface treatment agent, and a ratio of isophorone diisocyanate in a gas component obtained by heating at least one of the sizing agent and the surface treatment agent at 280°C for one hour is 1-20 mass%.SELECTED DRAWING: Figure 1
Inventors:
Akihito Okamoto
Application Number:
JP2018244715A
Publication Date:
June 30, 2023
Filing Date:
December 27, 2018
Export Citation:
Assignee:
Global Polyacetal Co., Ltd.
International Classes:
C08L77/06; C08K3/105; C08K3/16; C08K5/00; C08K5/098; C08K9/04
Domestic Patent References:
| JP2017115093A | ||||
| JP2016180084A | ||||
| JP2018119043A | ||||
| JP2016089080A | ||||
| JP2016124911A | ||||
| JP2017140768A |
Foreign References:
| WO2018123171A1 | ||||
| WO2017110372A1 |
Attorney, Agent or Firm:
Sykes Patent Attorney Corporation