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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2000034404
Kind Code:
A
Abstract:

To obtain a resin composition which exhibits good flowability in the cylinder of a molding machine and can give a molded product excellent in impact resistance and surface appearance by mixing a polyamide resin with a liquid-crystalline resin and an acid anhydride in a specified ratio.

This composition comprises 100 pts.wt. polyamide resin (e.g. nylon 6) desirably having a melting point of 200°C or above, 0.01-100 pts.wt. liquid-crystalline resin (e.g. a resin obtained by polycondensing hydroxybenzoic acid, 4,4-dihydroxybiphenyl, terephthalic acid, polyethylene terephthalate, and acetic anhydride through the elimination of acetic acid) desirably having a liquid crystal initiation temperature equal to or lower than the melting point of the polyamide resin, and 0.01-5 pts.wt. acid anhydride. If necessary, it may additionally contain 5-300 pts.wt. filler (e.g. carbon fiber) per 100 pts.wt. total of the polyimide resin, the liquid-crystalline resin, and the acid anhydride. It is desirable that the acid anhydride is at least one member selected among succinic anhydride, 1,8-naphthalic anhydride, phthalic anhydride, and maleic anhydride.


Inventors:
UMETSU HIDEYUKI
SUGIMURA MASAHIRO
MAKABE YOSHIKI
Application Number:
JP11656199A
Publication Date:
February 02, 2000
Filing Date:
April 23, 1999
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/00; C08K5/09; C08L67/00; C08L77/00; (IPC1-7): C08L77/00; C08K5/09; C08L67/00