Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREFROM
Document Type and Number:
Japanese Patent JP2008133430
Kind Code:
A
Abstract:
To provide a polyamide resin composition being balanced in flowability and the resistance to antifreezing liquids in a high level.
The polyamide resin composition comprises, based on 100 pts.wt. polyamide resin (a) having 7 amide group concentration, 10-200 pts.wt. inorganic filler (b) and 0.01-30 pts.wt. resinous polyester resin (c), wherein the polyester resin comprises at least one sort of structural unit selected from aromatic oxycarbonyl units (S), aromatic and/or aliphatic dioxy units (T) and aromatic dicarboxy units (U), and 3 functional organic residues (D), wherein the content of D is in the range of 7.5-50 mole% based on the all monomers constituting the resinous polyester resin.
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Inventors:
MATSUOKA HIDEO
HAMAGUCHI MITSUSHIGE
YOKOE MAKIHITO
HAMAGUCHI MITSUSHIGE
YOKOE MAKIHITO
Application Number:
JP2007195748A
Publication Date:
June 12, 2008
Filing Date:
July 27, 2007
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; C08G63/00; C08K3/00; C08L67/00
Domestic Patent References:
| JP2008517117A | 2008-05-22 | |||
| JPH04227657A | 1992-08-17 | |||
| JPS6140262B2 | 1986-09-08 | |||
| JP2008517117A | 2008-05-22 |
Previous Patent: JP2008133429
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