POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDING

Title:

POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDING

Document Type and Number:

Japanese Patent JP2023113400

Kind Code:

A

Abstract:

To provide a polyamide resin having improved moldability and durability while maintaining heat resistance, a polyamide resin composition, and a molding.SOLUTION: A polyamide resin comprises a polymer block (A) comprising 50 mol% or more of a constitutional unit derived from polyamide, and a chain extender (B). In the polyamide resin, the content of the polymer block (A) is 91.0 mass% or more and less than 99.0 mass%. The polyamide resin has a weight average molecular weight of 40,000-150,000.SELECTED DRAWING: None

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Inventors:

MINAMIGUCHI DAIKI

Application Number:

JP2022015743A

Publication Date:

August 16, 2023

Filing Date:

February 03, 2022

Export Citation:

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Assignee:

KURARAY CO

International Classes:

C08G69/48; C08G69/26; C08G69/44; C08L77/06

Attorney, Agent or Firm:

Patent Attorney Corporation Otani Patent Office

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