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Title:
POLYAMIDE RESIN COMPOSITION AND MOLDING COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2006152256
Kind Code:
A
Abstract:

To obtain a polyamide resin composition that has extremely excellent impact resistance and durability, low water absorption properties and excellent properties such as heat resistance, sliding properties, chemical resistance, etc.

The polyamide resin composition comprises a polyamide (I) having a dicarboxylic acid unit (a) containing 50-100 mol% of a terephthalic acid unit and a diamine unit (b) containing 50-100 mol% of a 1,9-nonanediamine unit and/or a 2-methyl-1,8-octanediamine unit and an olefin-based polymer (II) having at least one kind of a functional group selected from the group consisting of a carboxy group, an acid anhydride group and an epoxy group and ≤50 MPa tensile modulus at 23°C in the weight ratio of the polyamide (I) to the olefin-based polymer (II) by weight of 99.5:0.5-50:50.


Inventors:
MUNESAWA YUJI
YAMASHITA TAKASHI
Application Number:
JP2005308082A
Publication Date:
June 15, 2006
Filing Date:
October 24, 2005
Export Citation:
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Assignee:
KURARAY CO
International Classes:
C08L77/06; C08G69/26; C08K3/00; C08L23/26; C08L27/12; C08L83/04; F16C33/20; F16H55/06; F16J1/01
Attorney, Agent or Firm:
Taji U.S. Patent Office