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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2007119581
Kind Code:
A
Abstract:

To obtain a polyamide resin composition having excellent mechanical properties and sliding properties such as friction properties and wear properties and a molding made by using the same.

The polyamide resin composition comprises 70-99 parts by mass of a polyamide resin and 30-1 part by mass of rubber or an elastomer resin having 1-500 nm weight-average particle diameter. The polyamide resin composition is obtained by mixing 100 parts by mass of the polyamide resin composition with ≤5 parts by mass of at least one kind of an additive selected from talc, phosphate powder and lubricating oil.


Inventors:
Fujii, Shigeta
Application Number:
JP2005000312978
Publication Date:
May 17, 2007
Filing Date:
October 27, 2005
Export Citation:
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Assignee:
UNITIKA LTD
International Classes:
C08L77/00; C08K3/32; C08K3/34