POLYAMIDE RESIN COMPOSITION AND PACKAGING FILM MADE THEREFROM

Title:

POLYAMIDE RESIN COMPOSITION AND PACKAGING FILM MADE THEREFROM

Document Type and Number:

Japanese Patent JP2000309702

Kind Code:

A

Abstract:

To provide a polyamide resin composition excellent in blocking resistance and transparency, and a packaging film made therefrom.

The resin composition is obtained by melting and kneading the following components (A) and (B), (A) 1-40 pts.wt. silica-containing polyamide resin which consists of 95.0-99.4 wt.% polyamide resin and 5.0-0.6 wt.% silica, wherein the silica has a specific surface (S) of 50-1,000 m2/g and has a surface treated with a silane coupling agent in such a manner that the value obtained by dividing the amount (M) of treatment (moles/g of silica) by the specific surface (S) (m2/g), (M/S=N), is 0.1×10-6 to 30×10-6 (moles/-m2 of silica); and (B) 99-60 pts.wt. polyamide resin substantially free from silica.

Inventors:

MIYAMOTO MASAAKI
YAMAMOTO MASANORI
NISHIDA YUICHI

Application Number:

JP11996699A

Publication Date:

November 07, 2000

Filing Date:

April 27, 1999

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP

International Classes:

C08J5/18; C08G69/04; C08G69/28; C08K3/36; C08K5/17; C08K5/20; C08K9/06; C08L77/00; (IPC1-7): C08L77/00; C08G69/04; C08G69/28; C08J5/18; C08K3/36; C08K5/17; C08K5/20; C08K9/06

Attorney, Agent or Firm:

Hasegawa Moji

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