POLYAMIDE RESIN COMPOSITION, AND PRODUCTION METHOD THEREOF

Title:

POLYAMIDE RESIN COMPOSITION, AND PRODUCTION METHOD THEREOF

Document Type and Number:

Japanese Patent JP2014133871

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a polyamide resin composition capable of providing a molded article having high flexural strength and high temperature rigidity.SOLUTION: A polyamide resin composition contains: (A) 100 pts.wt. of a polyamide resin including a diamine unit and a dicarboxylic acid unit, the diamine unit including 10 to 100 mol% of a pentamethylene diamine unit: (B) 0.05 to 10 pts.wt. of a nonfibrous inorganic filler; and (C) 10 to 200 pts.wt. of a fibrous inorganic filler.

Inventors:

OKUBO TAKURO
MASUNAGA ATSUSHI
NAKAGAWA YASUSHI
KATO KIMIYA
UMEZU HIDEYUKI

Application Number:

JP2013243507A

Publication Date:

July 24, 2014

Filing Date:

November 26, 2013

Export Citation:

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Assignee:

TORAY INDUSTRIES

International Classes:

C08L77/06; C08G69/26; C08J3/20; C08K3/00; C08K7/04

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