Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2006056938
Kind Code:
A
Abstract:
To provide a polyamide resin composition which comprises a polyamide resin, a fibrous reinforcing material, and an inorganic filler, and has excellent flowability and rigidity.
This polyamide resin composition comprising a polyamide resin (a), a fibrous reinforcing material (b), and an inorganic filler (c) excluding (a) in amounts of 35 to 60 wt. %, 35 to 60 wt. %, and 1 to 20 wt. %, respectively, per 100 wt. % of the polyamide resin composition, is characterized in that the relative viscosity of the polyamide resin (a) is ≤2.3 measured at 25°C in a 98 % concentrated sulfuric acid solution having a sample concentration of 0.01 g/ml.
Inventors:
YAMADA MOTONOBU
OKAMOTO MASARU
INABA HAJIME
OKAMOTO MASARU
INABA HAJIME
Application Number:
JP2004238020A
Publication Date:
March 02, 2006
Filing Date:
August 18, 2004
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; C08K3/00; C08K7/02