Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2010229232
Kind Code:
A
Abstract:
To provide a resin composition having high flowability during molding and giving an injection molding with high welding properties at a joint part thereof which is problematic in the conventional nylon resin; and to provide a molding thereof.
The polyamide resin composition includes, based on 100 pts.wt. of a polyamide resin (A) having a melting point of ≥230°C, 0.1-20 pts.wt. of a polyamide oligomer (B) containing 15-30 carbon atoms per amide group and having a number average molecular weight of 3,000-7,000. A process for producing an injection welding molding utilizes the polyamide resin composition.
Inventors:
YOSHIDA TETSUYU
NISHIMOTO HIROAKI
YAMADA MOTONOBU
NISHIMOTO HIROAKI
YAMADA MOTONOBU
Application Number:
JP2009076420A
Publication Date:
October 14, 2010
Filing Date:
March 26, 2009
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; B29C45/16; C08K3/00
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