Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2020125439
Kind Code:
A
Abstract:
To provide a polyamide resin composition capable of obtaining a molded article which is excellent in mechanical strength after thermal aging and its variation and is excellent in press fit characteristics after thermal aging.SOLUTION: A polyamide resin composition contains the following components (A), (B) and (C), in which the following component (C) is 0.01-3.0 pts.wt. with respect to 100 pts.wt. of the following component (A), and a crystallization temperature change amount during cooling ΔTmc before and after heating a molded article with a thickness of 1 mm at 180°C for 375 hours obtained by molding the polyamide resin composition is 4°C or higher and 16°C or lower. Component (A): polyamide resin, Component (B): copper and/or copper compound, and Component (C): a resin having a structural unit derived from an acid anhydride.SELECTED DRAWING: None
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Inventors:
KOMIYA TAKESHI
NISHIDA SHINGO
TAMAI AKIYOSHI
UMEZU HIDEYUKI
NISHIDA SHINGO
TAMAI AKIYOSHI
UMEZU HIDEYUKI
Application Number:
JP2019116541A
Publication Date:
August 20, 2020
Filing Date:
June 24, 2019
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; C08K3/08; C08K3/18; C08K5/053; C08L35/06
Attorney, Agent or Firm:
Toshimitsu Ban
Koichi Hosoda
Koichi Hosoda