Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3556007
Kind Code:
B2
Abstract:
PURPOSE: To obtain a polyamide resin compsn. which has both low water absorption properties and a high flame retardancy.
CONSTITUTION: This compsn. is prepd. by compounding 100 pts.wt. resin component comprising 20-80 pts.wt. polyamide resin and 80-20 pts.wt. polyphenylene ether resin optionally contg. a polystyrene resin with 0.01-10 pts.wt. compatibilizer, 1-50 pts.wt. uncured phenol novolak resin. and 0-80 pts.wt. rubber component.
Inventors:
Takusei Takatani
Hiromi Ishida
Hiromi Ishida
Application Number:
JP7843595A
Publication Date:
August 18, 2004
Filing Date:
March 10, 1995
Export Citation:
Assignee:
Japan GE Plastics Co., Ltd.
International Classes:
C08L25/04; C08L61/04; C08L61/10; C08L71/00; C08L21/00; C08L71/12; C08L73/00; C08L77/00; C08L61/06; (IPC1-7): C08L77/00; C08L21/00; C08L25/04; C08L61/10; C08L71/12
Domestic Patent References:
| JP6128476A | ||||
| JP6065500A |
Attorney, Agent or Firm:
Mitsuo Matsui
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