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Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06122815
Kind Code:
A
Abstract:

PURPOSE: To obtain a polyamide resin composition capable of providing a molded article having excellent heat resistance and impact resistance and low water absorption ratio by blending an aromatic polysulfone having a specific structure with a polyamide resin.

CONSTITUTION: This polyamide resin composition comprises (A) 15-45wt.% aromatic polysulfone composed of a repeating unit of formula I or an aromatic polysulfone composed of 50mol% or more repeating unit of formula I and 50mol% or less, preferably 5-30mol% repeating unit of formula II, having 0.35-0.6dl/g reduced viscosity (in dimethylformamide at 1g/dl concentration at 30°C), for example, obtained by polymerizing an OH-containing monomer and a halogen-containing monomer (at least one containing sulfonyl group) in the presence of an alkali metal carbonate in an aprotic polar solvent (e.g. sulfolane) in an inert gas, (B) 85-55wt.% polyamide (e.g. nylon 66 or polyester amide) and optionally various kinds of additives.


Inventors:
FUKAI TOMOHIRO
NAGAI YASUHIKO
NAKAYAMA YASUSHI
SAITO TORANOSUKE
KADOMACHI HIRONORI
KISHIMOTO DAISHIROU
Application Number:
JP27441592A
Publication Date:
May 06, 1994
Filing Date:
October 13, 1992
Export Citation:
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Assignee:
SANKO CHEMICAL CO LTD
SEKISUI CHEMICAL CO LTD
International Classes:
C08L77/00; C08L81/00; C08L81/06; (IPC1-7): C08L77/00; C08L81/06
Attorney, Agent or Firm:
Shusaku Yamamoto