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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0748490
Kind Code:
A
Abstract:

PURPOSE: To obtain the composition useful as electric.electronic parts, having improved moldability, processability and light resistance by blending a polyamide with a polyphenylene ether resin, a polystyrene resin, a rubber-like polymer and a modifier under a specific condition.

CONSTITUTION: (A) A polyamide is blended with (B) a polyphenylene ether resin, (C) a polystyrene resin, (D) a rubber-like polymer and (E) a modifier compound containing a carboxylic acid group, acid anhydride group, epoxy group, amino group or hydroxyl group and the components B to D are dispersed into the continuous phase of the component A to form a disperse phase having ≤5μm average particle diameter. The weight ratio of the component B/the component C is 70:30-20:80, the reduced viscosity ηsp/C is ≥0.70dl/g and the ratio of the composition D is 0.1-50wt.% based on the resin of the disperse phase.


Inventors:
NAKABASHI JUNICHI
YOSHIDA KAZUO
HORIO MITSUHIRO
Application Number:
JP10253194A
Publication Date:
February 21, 1995
Filing Date:
May 17, 1994
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C08L25/00; C08L21/00; C08L25/04; C08L71/00; C08L71/12; C08L73/00; C08L77/00; (IPC1-7): C08L25/04; C08L25/00; C08L71/12; C08L77/00