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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH08134347
Kind Code:
A
Abstract:

PURPOSE: To obtain a composition, excellent in especially light discoloration resistance, molding fluidity, appearance of moldings and impact resistance as compared with a conventional material and useful for automotive, electrical and electronic parts, civil engineering and building, etc.

CONSTITUTION: This thermoplastic resin composition has a structure of a continuous phase formed of a polyamide resin and a dispersed phase, containing (B) a polyphenylene ether resin and (C) a polystyrene resin and having ≤5μm average particle diameter thereof at (70/30) to (20/80) ratio of the components (B)/(C) in the resin composition comprising (A) the polyamide resin, the components (B) and (C) and further (D) a modifying agent. In the composition, the component (C) has ≥0.70dl/g reduced viscosity ηsp/c.


Inventors:
NAKABASHI JUNICHI
HORIO MITSUHIRO
YOSHIDA KAZUO
Application Number:
JP30161094A
Publication Date:
May 28, 1996
Filing Date:
November 11, 1994
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C08L25/04; C08F291/00; C08L71/00; C08L71/12; C08L73/00; C08L77/00; (IPC1-7): C08L77/00; C08F291/00; C08L25/04; C08L71/12
Attorney, Agent or Firm:
Takeshi Shimizu (2 outside)