Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH09328609
Kind Code:
A
Abstract:
To obtain a polyamide resin composition extremely excellent in oil resistance and thermal stability, by blending a polyamide resin with a polycarbodiimide.
This composition comprises (A) 45-99.99wt.% of a polyamide resin, (B) 0.01-40wt.% of a polycarbodiimide and (C) 0-50wt.% of a bromine- containing polystyrene. Preferably, the component C has 1×104 to 15×104 number-average molecular weight (Mn) and ≤5 weight-average molecular weight (Mw)/Mn. Preferably, 100 pts.wt. of the total of the component A to the component C is mixed with 1-200 pts.wt. of a filler. Consequently, a polyamide resin can be developed in uses in a wide range.
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Inventors:
KASAI KAZUO
KAWASE RIYOUYA
TAKAHASHI MASAYUKI
FUJIWARA HIDEETSU
KAWASE RIYOUYA
TAKAHASHI MASAYUKI
FUJIWARA HIDEETSU
Application Number:
JP17172096A
Publication Date:
December 22, 1997
Filing Date:
June 11, 1996
Export Citation:
Assignee:
JAPAN SYNTHETIC RUBBER CO LTD
International Classes:
C08L25/18; C08L73/00; C08L77/00; C08L79/00; (IPC1-7): C08L77/00; C08L25/18; C08L77/00; C08L79/00
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