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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS62250053
Kind Code:
A
Abstract:

PURPOSE: To obtain a resin composition having excellent gasoline resistance, solvent resistance, rigidity and low-temperature impact resistance, by compounding a polyamide with an ethylenic resin, a polyethylene wax, a pigment and a resin and/or rubber having carboxyl group.

CONSTITUTION: (A) 100pts.(wt.) of a polyamide is compounded with (B) 0.5W10pts. of an ethylenic resin such as ethylene-acrylic acid copolymer, etc., having an ethylene content of ≥50mol%, (C) 0.5W10pts. of a polyethylene wax having a mol.wt. of 2,000W15,000 and a softening point of 95W140°C, (D) 0.5W10pts. of a pigment such as carbon black (e.g. ketjenblack) and (E) 1W55pts. of a resin and/or rubber having carboxyl group, e.g. ethylene-propylene copolymer rubber grafted with maleic anhydride, etc. The compounding of the components is carried out by mixing, melting and kneading the components BWE to produce master batch pellets and compounding the pellets to the component A.


Inventors:
MINOURA TATSUO
Application Number:
JP9267086A
Publication Date:
October 30, 1987
Filing Date:
April 22, 1986
Export Citation:
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Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
C08L23/04; C08K3/04; C08L7/00; C08L13/00; C08L21/00; C08L23/00; C08L23/06; C08L33/00; C08L33/02; C08L51/00; C08L51/02; C08L77/00; C08L101/00; (IPC1-7): C08K3/04; C08L13/00; C08L23/04; C08L23/06; C08L77/00