Title:
ポリアミド系樹脂発泡粒子及びポリアミド系樹脂発泡粒子成形体
Document Type and Number:
Japanese Patent JP7424855
Kind Code:
B2
Abstract:
To provide polyamide-based resin foam particles which are excellent in moldability.SOLUTION: Polyamide-based resin foam particles are obtained by foaming a polyamide-based resin. In heat flux differential scanning calorimetry (DSC), the polyamide-based resin foam particles are used as a test piece, in a DSC curve in first heating obtained by heating to a temperature higher than a temperature at the time of end of a melting peak by 30°C or more, from 30°C at heating speed of 10°C/min, the DSC curve has a main melting peak (inherent peak) inherent to the polyamide-based resin, an extrapolation melting finishing temperature of the DSC curve is a temperature higher than a top temperature of the inherent peak by 7°C or more, and bulk density of the polyamide-based resin foam particles is 10-300 kg/m3.SELECTED DRAWING: Figure 1
Inventors:
Satoshi Otsuka
Tatsuya Hayashi
Akinobu Taira
Tatsuya Hayashi
Akinobu Taira
Application Number:
JP2020023574A
Publication Date:
January 30, 2024
Filing Date:
February 14, 2020
Export Citation:
Assignee:
JSP Corporation
International Classes:
C08J9/228; C08J9/16
Domestic Patent References:
| JP2019099955A | ||||
| JP2018188177A | ||||
| JP2013166429A | ||||
| JP2004066720A |
Foreign References:
| WO2021125264A1 | ||||
| WO2020031803A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office