Title:
POLYAMIDEIMIDE RESIN COMPOSITION, ITS VARNISH, AND PRODUCTION OF THE VARNISH
Document Type and Number:
Japanese Patent JP3446845
Kind Code:
B2
Abstract:
PURPOSE: To obtain a polyamideimide resin compsn. excellent in heat resistance and clarity and sol. in a low-boiling, general-purpose alcoholic solvent and to obtain its varnish and to provide a process for producing the varnish.
CONSTITUTION: This resin compsn. is sol. in an alcoholic solvent, has a glass transition point of 120°C or higher and a logarithmic viscosity of 0.1dl/g or higher, and forms a dried film which, when 30μm thick, exhibits a light transmission of 75% or higher at a wavelength of 500nm. A varnish is prepd. from this resin compsn.
Inventors:
Tadashi Inukai
Tomoharu Kurita
Hiroki Yamaguchi
Keiichi Uno
Tomoharu Kurita
Hiroki Yamaguchi
Keiichi Uno
Application Number:
JP24955794A
Publication Date:
September 16, 2003
Filing Date:
October 14, 1994
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA
International Classes:
C09D179/08; C08G73/14; C08L79/08; (IPC1-7): C08G73/14; C08L79/08; C09D179/08
Domestic Patent References:
| JP8113647A | ||||
| JP8113646A |