Title:
POLYAMIDEIMIDE RESIN AND CURABLE RESIN COMPOSITION COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2009114431
Kind Code:
A
Abstract:
To provide a polyamideimide resin which allows a resin composition to be cured satisfactorily even at low temperature when incorporated in the resin composition and to provide a curable resin composition which comprises the polyamideimide resin and has excellent curability at low temperature.
The polyamideimide resin comprises the constituent unit shown by general formula (1) (wherein R is a bivalent organic group having a phenolic hydroxy group).
Inventors:
EJIRI TAKAKO
MASUDA KATSUYUKI
MASUDA KATSUYUKI
Application Number:
JP2008254445A
Publication Date:
May 28, 2009
Filing Date:
September 30, 2008
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G18/34; C08G73/14
Domestic Patent References:
| JP2007240554A | 2007-09-20 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hideki Okita
Yoshinori Shimizu
Hideki Okita