To provide an insulation coating by which an insulation film of a uniform thickness can be formed over an entire circumference of a flat conductor and an insulation film with good workability and productivity can be provided, and to provide an insulated wire with the coating applied and baked.

The polyamideimide resin insulation coating is obtained by dissolving polyamideimide resin obtained by synthesizing and reacting an isocyanate component mainly containing 4, 4'-diphenylmethane diisocyanate, and an acid component mainly containing trimellitic anhydride in a solvent component mainly containing cyclic ketones having a boiling point in a range of 130-180°C. The solvent component of 70-100 mass% is the cyclic ketones, and a ratio (a+b)/(A+B) of a compounding amount of the 4,4'-diphenylmethane diisocyanate (a) and the trimellitic anhydride (b) with respect to a compounding amount of the isocyanate component (A) and the acid component (B) is 85-100 mol% by mole ratio.