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Title:
めっき密着力に優れたポリカーボネート−ABS系アロイ樹脂組成物及びそれを含む成形品
Document Type and Number:
Japanese Patent JP6449452
Kind Code:
B2
Abstract:
The present disclosure relates to a polycarbonate-ABS based alloy resin composition having superior plating adhesion and a molded article manufactured therefrom. More particular, the present disclosure relates to a polycarbonate-ABS based alloy resin composition having superior plating adhesion due to inclusion of (a) 35 to 75 % by weight of a polycarbonate resin; (b) 5 to 35 % by weight of a copolymer prepared by polymerizing a conjugated diene rubber having an average particle diameter of 0.6 to 1.5 µm, an aromatic vinyl compound, and a vinyl cyanide compound; (c) 5 to 20 % by weight of a copolymer prepared by polymerizing a conjugated diene rubber having an average particle diameter of 0.2 µm or more and less than 0.6 µm, an aromatic vinyl compound, and a vinyl cyanide compound; (d) 5 to 20 % by weight of a copolymer prepared by polymerizing a conjugated diene rubber having an average particle diameter of 0.1 to 0.3 µm, an aromatic vinyl compound, and a (meth)acrylate compound; and (e) 0 to 40 % by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer, and a molded article including the polycarbonate-ABS based alloy resin composition. In accordance with the present disclosure, a polycarbonate-ABS based alloy resin composition having superior plating adhesion as well as superior mechanical properties, and a molded article including the polycarbonate-ABS based alloy resin composition.

Inventors:
Kim, Choi-fan
Kim, Myung-Il
Yoo, Suk-Che
Lee, Seung-ho
Anne, Son-Te
Jung, Min-ho
Application Number:
JP2017517346A
Publication Date:
January 09, 2019
Filing Date:
September 26, 2016
Export Citation:
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Assignee:
LG HAUSYS,LTD.
International Classes:
C08L69/00; B29C48/92; C08L25/12; C08L51/04; C08L55/02
Domestic Patent References:
JP9151293A
JP2002294059A
JP5117515A
JP59155436A
JP10250496A
JP2015108123A
Foreign References:
US20110159293
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners