Title:
POLYCARBONATE-BASED RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2012067208
Kind Code:
A
Abstract:
To provide a material developable of high conductivity and good moldability, while reducing a conductive material contained in a polycarbonate-based resin.
The polycarbonate-based resin composition containing a polycarbonate-based resin (A) and a styrene-based resin (master batch) (B) containing carbon nanotubes, wherein the styrene-based resin (B) is obtained by highly dispersing carbon nanotubes in a monomer stage and polymerizing, and the molding obtained by using the resin composition are provided, and thereby the material developable of good moldability and high conductivity with a small amount content of the conductive material is provided.
Inventors:
NONOKAWA DAIGO
TAKADA SHINGO
SUZUKI TORU
TAKADA SHINGO
SUZUKI TORU
Application Number:
JP2010213614A
Publication Date:
April 05, 2012
Filing Date:
September 24, 2010
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08L69/00; C08K3/04; C08L25/04
Attorney, Agent or Firm:
Kono Tsuyo
Previous Patent: 電動ブレーキアクチュエータの車体取付構造
Next Patent: PHENOL RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND FRICTION MATERIAL
Next Patent: PHENOL RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND FRICTION MATERIAL