Title:
【発明の名称】多結晶ダイヤモンド工具
Document Type and Number:
Japanese Patent JP3102427
Kind Code:
B1
Abstract:
A diamond sintered compact cutting tool comprising a diamond sintered compact sintered at an ultra-high pressure and high temperature and a WC-Co type cemented carbide substrate directly bonded to the diamond sintered compact during a step of sintering and brazed to a tool base through the WC-Co type cemented carbide substrate, wherein the ratio of the thickness of the WC-Co type cemented carbide substrate to the thickness of the diamond sintered compact layer satisfies the relationship: 0.8 ≤ WC-Co type cemented carbide substrate/diamond sintered compact layer ≤ 3.0 and wherein the diamond sintered compact layer has a thickness of 0.05 mm to 0.5 mm, preferably 0.05 mm to 0.45 mm.
Inventors:
Katsuhito Yoshida
Junichi Shiraishi
Tetsuo Nakai
Junichi Shiraishi
Tetsuo Nakai
Application Number:
JP13728199A
Publication Date:
October 23, 2000
Filing Date:
May 18, 1999
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
B23B27/20; B22F7/00; B22F7/06; B23B27/18; C04B37/02; C22C26/00; C23C30/00; (IPC1-7): B23B27/20; B22F7/00; B23B27/18; C22C26/00
Domestic Patent References:
| JP63203704A | ||||
| JP59107806A | ||||
| JP59118802A | ||||
| JP6386804A | ||||
| JP200054007A |
Attorney, Agent or Firm:
Ryoichi Hagiwara (2 others)
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