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Patent Searching and Data


Title:
POLYESTER-BASED RESIN COMPOSITION AND HEAT-SEALABLE FILM
Document Type and Number:
Japanese Patent JPH05222275
Kind Code:
A
Abstract:
PURPOSE:To provide the subject composition containing a specified copolyester, polycarbonate, a thermoplastic elastomer, etc., excellent in heat resistance, heat sealability and mechanical strength and suitable for a packaging film, etc. CONSTITUTION:The objective composition contains (A) preferably 50 to 90wt.% copolyester synthesized from one or more diol components selected from aliphatic diols, alicyclic diols and aromatic diols and containing 1,4-butanediol and terephthalic acid or two or more kinds of dicarboxylic acids containing terephthalic acid as the dicarboxylic acid component and (B) preferably 5 to 50wt.% polycarbonate and (C) preferably 0.5 to 20wt.% thermoplastic elastomer or polycaprolactone. In addition, a heat-sealable film can be obtained from the above-mentioned composition.

Inventors:
SUZUKI MASAHIKO
Application Number:
JP5676592A
Publication Date:
August 31, 1993
Filing Date:
February 07, 1992
Export Citation:
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Assignee:
DAICEL CHEM IND LTD
International Classes:
B29C47/00; B29C55/02; C08J5/18; C08L67/00; C08L67/02; C08L67/04; C08L69/00; B29K67/00; B29L7/00; (IPC1-7): B29C47/00; B29C55/02; B29K67/00; B29L7/00; C08J5/18; C08L67/00; C08L67/02; C08L67/04; C08L69/00
Attorney, Agent or Firm:
鍬田 充生