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Patent Searching and Data


Title:
POLYESTER RESIN FOR PRESSURE-SENSITIVE ADHESIVE AND PRESSURE-SENSITIVE ADHESIVE COMPOSITION USING THE SAME
Document Type and Number:
Japanese Patent JP2010001375
Kind Code:
A
Abstract:

To provide a polyester resin for pressure-sensitive adhesives, which can give pressure-sensitive adhesive compositions excellent in adhesiveness to various adherends and excellent in adhesiveness to low polar adherends, such as polyolefins, especially without an adhesiveness-imparting agent such as a tackifier.

The polyester resin for the pressure-sensitive adhesives contains structures originated from a 18C fatty acid or a 18C fatty acid derivative as side chains. Also, a pressure-sensitive adhesive composition comprises the polyester resin for the pressure-sensitive adhesives, and a reactive compound capable of reacting with the polyester resin.


Inventors:
UMEZAWA MITSUO
NAKAMURA NAOTOSHI
Application Number:
JP2008161070A
Publication Date:
January 07, 2010
Filing Date:
June 20, 2008
Export Citation:
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Assignee:
TOYO INK MFG CO
International Classes:
C09J167/00; C09J11/06
Domestic Patent References:
JPH06500350A1994-01-13
JPS4317517B11968-07-24
JPS37525B1
JPS534B21978-01-05
JP154131C
JP100492C