PURPOSE: To obtain a resin compsn. excellent in heat resistance and permanent antistatic properties by compounding a specific polyetheresteramide derived from a polyamide having a specified mol.wt. and an arom. polyether with a thermoplastic resin.
CONSTITUTION: A resin compsn. is prepd. by compounding a polyetheresteramide (C) derived from a polyamide (A) having carboxyl groups at both molecular ends and a number-average mol.wt. of 500-5,000 and an arom. polyether (B) represented by the formula [wherein Z is a residue of a dihydric phenol (e.g. a bisphenol); Q is 2-4C oxyalkylene; X is an alkylene residue of a 1-18C alkylene dihalide; m is 1-30; and n is 1-25] with a thermoplastic resin (D) (e.g. a styrenic resin) in a wt. ratio of C to D of (5:95)-(40:60). Polymer A is obtd., e.g. by the ring-opening polymn. of a lactam (esp. -caprolactam), and polymer B, e.g. from bisphenol A, ethylene oxide, and methylene chloride.
SENDA HIDEKAZU