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Title:
POLYETHERESTERAMIDE AND RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0848768
Kind Code:
A
Abstract:

PURPOSE: To obtain a resin compsn. excellent in heat resistance and permanent antistatic properties by compounding a specific polyetheresteramide derived from a polyamide having a specified mol.wt. and an arom. polyether with a thermoplastic resin.

CONSTITUTION: A resin compsn. is prepd. by compounding a polyetheresteramide (C) derived from a polyamide (A) having carboxyl groups at both molecular ends and a number-average mol.wt. of 500-5,000 and an arom. polyether (B) represented by the formula [wherein Z is a residue of a dihydric phenol (e.g. a bisphenol); Q is 2-4C oxyalkylene; X is an alkylene residue of a 1-18C alkylene dihalide; m is 1-30; and n is 1-25] with a thermoplastic resin (D) (e.g. a styrenic resin) in a wt. ratio of C to D of (5:95)-(40:60). Polymer A is obtd., e.g. by the ring-opening polymn. of a lactam (esp. -caprolactam), and polymer B, e.g. from bisphenol A, ethylene oxide, and methylene chloride.


Inventors:
UEDA YASUHIRO
SENDA HIDEKAZU
Application Number:
JP25287894A
Publication Date:
February 20, 1996
Filing Date:
September 20, 1994
Export Citation:
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Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08G69/44; C08L23/02; C08L25/04; C08L33/04; C08L33/06; C08L33/10; C08L33/18; C08L33/20; C08L47/00; C08L53/00; C08L67/00; C08L67/02; C08L73/00; C08L77/00; C08L77/12; C08L87/00; C08L101/00; C08L101/02; (IPC1-7): C08G69/44; C08L23/02; C08L25/04; C08L33/10; C08L33/20; C08L47/00; C08L53/00; C08L67/02; C08L77/12; C08L101/00; C08L101/02