Title:
POLYETHYLENE MULTILAYER SUBSTRATE, PRINTING SUBSTRATE, LAMINATE AND PACKAGING MATERIAL
Document Type and Number:
Japanese Patent JP2023024142
Kind Code:
A
Abstract:
To provide a polyethylene multilayer substrate that is excellent in ink adhesion and heat resistance.SOLUTION: A polyethylene multilayer substrate is formed by stretching, having a first layer containing middle-density polyethylene and high-density polyethylene, a second layer containing high-density polyethylene, a third layer containing linear low-density polyethylene, a fourth layer containing high-density polyethylene, and a fifth layer containing middle-density polyethylene and high-density polyethylene, in a thickness direction in this order.SELECTED DRAWING: Figure 1
Inventors:
YAMADA KENICHI
Application Number:
JP2021130255A
Publication Date:
February 16, 2023
Filing Date:
August 06, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B32B27/32; B32B27/18; B65D65/40
Attorney, Agent or Firm:
Nakamura Yukitaka
Miyajima Manabu
Asano Mari
Miyajima Manabu
Asano Mari
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