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Patent Searching and Data


Title:
POLYETHYLENE MULTILAYERED FILM TO BE METALLIZED
Document Type and Number:
Japanese Patent JPH06270357
Kind Code:
A
Abstract:

PURPOSE: To provide a remarkably good low-temperature impact resistance, a good adhesion to a metallizing film, and a superior heat-sealing characteristics by a method wherein a multilayered film to be metallized is formed by adding a specific ratio of polymer fine particles specified by an average particle diameter and others to three polyethylene resin layers each having a specific density.

CONSTITUTION: In a three-layer laminated film mainly composed of plyethylene resins, a polyethylene resin having a density of 0.930 to below 0.939g/cm3 is used as a layer A, a polyethylene resin having a density of 0.890 to and including 0.930g/cm3 is used as a layer B, and a polyethylene resin having a density of 0.930 to below 0.939g/cm3 is used as a layer C. Polymer fine particles having an average particle diameter of 5μm or more, a decomposition initiating temperature of 250°C or higher, and a particle minor axis/major axis ratio of 0.8 or more are incorporated by 0.2-1.5 pts.wt. per 100 pts.wt. of the resin of each layer. In this polyethylene multilayered film to be metallized with a metal or a metallic oxide, a slip agent is not incorporated in the layers A, B, and C.


Inventors:
NAGANO YUKARI
OGAWA HIROKI
KOHARA ATSUSHI
ICHIKI MAKOTO
Application Number:
JP8389093A
Publication Date:
September 27, 1994
Filing Date:
March 19, 1993
Export Citation:
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Assignee:
KOHJIN CO
International Classes:
B32B9/04; B32B15/08; B32B15/085; B32B27/20; B32B27/32; (IPC1-7): B32B27/32; B32B9/04; B32B15/08; B32B27/20