PURPOSE: To provide the titled compsn. which makes thick-wall molding of sealed parts possible and gives packaging bags having improved impact resistance, consisting of an ethylene/α-olefin copolymer and an ethylene/vinyl acetate copolymer.

CONSTITUTION: A PE resin compsn. for packaging bags, having excellent heat- sealing characteristics, consists of 100pts.wt. ethylene/α-olefin copolymer having a density of 0.915W0.940g/cm3 and an MI of 0.1W5.0g/10min and 10W65pts.wt. ethylene/vinyl acetate copolymer having a vinyl acetate content of 3W30wt%. Since the compsn. has very high heat shrinkage stress, sealed parts are capable of thick-wall molding so that sealed film is thick and impact resistance is improved. Further, the compsn. can be used over a wide sealing temperature range. Even when dust caused by filling rice, fertilizer, etc. or water droplet caused by filling liquid is deposited, impact resistance in heat-sealed parts can be retained by high-temperature heat sealing.