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Title:
POLYHYDROXYETHER, HEAT-CURABLE ADHESIVE COMPOSITION AND ADHESIVE PRODUCT
Document Type and Number:
Japanese Patent JP2001139680
Kind Code:
A
Abstract:

To provide heat-curable adhesive compositions which have low flow characteristics in thermo compression bonding and, at the same time, do not need drying after heat curing and can withstand intense heat even when temporarily exposed to the intense heat.

The heat-curable adhesive compositions are constituted by comprising (a) a polyhydroxyether represented by formula (I), (b) an epoxy resin, and (c) a curing agent for the epoxy resin.


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Inventors:
KAWATE KOICHIRO
Application Number:
JP32681699A
Publication Date:
May 22, 2001
Filing Date:
November 17, 1999
Export Citation:
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Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
C08G65/40; C09J133/00; C09J163/00; C09J171/10; (IPC1-7): C08G65/40; C09J133/00; C09J171/10
Domestic Patent References:
JPH11269264A1999-10-05
JP2000100872A2000-04-07
JP2000129217A2000-05-09
Attorney, Agent or Firm:
Takashi Ishida (4 others)



 
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