Title:
ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
Document Type and Number:
Japanese Patent JP7003795
Kind Code:
B2
Abstract:
To provide a polyimide, an adhesive, a film-like adhesive, an adhesion layer, an adhesive sheet, a copper foil with resin, a copper-clad laminate, a printed wiring board, and a multilayer wiring board and a method of producing the same.SOLUTION: The present invention provides: a polyimide that is a reactant of a monomer group containing an aromatic tetracarboxylic acid anhydride containing a symmetric aromatic tetracarboxylic acid anhydride and a diamine containing an aromatic diamine and a dimer diamine; an adhesive containing the polyimide, a crosslinker and an organic solvent; and a film-like adhesive, an adhesion layer, an adhesive sheet, a copper foil with resin, a copper-clad laminate, a printed wiring board, and a multilayer wiring board and a method of producing the same.SELECTED DRAWING: None
Inventors:
▲杉▼本 啓輔
Takashi Yamaguchi
Atsushi Shioya
Takashi Tazaki
Takashi Yamaguchi
Atsushi Shioya
Takashi Tazaki
Application Number:
JP2018063284A
Publication Date:
January 21, 2022
Filing Date:
March 28, 2018
Export Citation:
Assignee:
Arakawa Chemical Industry Co., Ltd.
International Classes:
C08G73/10; B32B27/00; B32B27/34; C09J7/10; C09J7/22; C09J7/28; C09J7/35; C09J11/06; C09J179/08; H05K1/03; H05K3/46
Domestic Patent References:
| JP2013199645A | ||||
| JP2015526561A | ||||
| JP2013112735A | ||||
| JP2016191049A | ||||
| JP2006068986A | ||||
| JP9012712A | ||||
| JP2013032501A | ||||
| JP2013155329A | ||||
| JP2013112753A |
Foreign References:
| WO2013008437A1 |